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I have been told that it can be sold, but it is expensive. Contact Saeid. Peter AlfkeArticle: 83701
Benjamin Menküc wrote: > Hi, > > my pad input clock is 100 MHz (clk_ibufg). I have constrained this to > period 10 ns. How should I constrain the lvds_tick, which runs at max. > 360 MHz ? Is this done automatically when I constrain clk_ibufg? > Should I constrain the 180 MHz clock too? > > regards, > Benjamin > > dcm2_1 : dcm2 port map ( > CLKIN_IN => clk_ibufg, > RST_IN => RESET, > CLKFX_OUT => clk_180m, > CLKDV_OUT => pixel_clk, > LOCKED_OUT => lvds_locked, > CLK0_OUT => open); > > dcm3_1: dcm3 PORT MAP( > CLKIN_IN => clk_180m , > RST_IN => not lvds_locked, > CLK0_OUT => open, > CLK2X_OUT => lvds_tick, > LOCKED_OUT => open > ); When you are cascading DCM's you should bring out the second DCM out of reset after some delay from the time the first DCM is locked. There was an appnote which used 16 bit shift register to delay the 'locked' signal from the first DCM. That could be one of the problems. Other thing I noticed is "Clock period: 14.088ns (frequency: 70.984MHz) " You said you constrained it to 100Mhz. Probably the constraint was not properly applied and hence ignored by the tool. BrijeshArticle: 83702
JD, The only difference for power at high temp versus low temp is leakage current. All of these blocks (DCM, DSP40, PPC405) are in the silicon and whether or not you are actively using them they are sitting there and leaking current from the VCCINT supply. Adding these into the power tool as a "used" element will change the dynamic portion of the power consumption for the device, but it won't change the leakage current component as this is function of the device that you selected which includes leakage from everything that is in the silicon. Ed JD_Design wrote: > Austin, > > I am probably not planning on using any of the DSP48 blocks, but I > noticed the same for them (no change over temperature). Apologies for > the skepticism, but it seems strange to me that I could load up my > device with DCMs, DSP48s, PPC405s and measure the power at room temp > and at high temp and have the difference between those two values be > the same difference I would get if I were using NONE of those resources > in the first place. > > Anyway, is there a spreadsheet for power calculations that I can get > that would allow me to both do this analysis offline? > > Thanks, > > JD > JDDC >Article: 83703
Hi Brijesh, > When you are cascading DCM's you should bring out the second DCM out of > reset after some delay from the time the first DCM is locked. There was > an appnote which used 16 bit shift register to delay the 'locked' signal > from the first DCM. That could be one of the problems. I will look at that, but I think thats no problem at the moment. > > Other thing I noticed is > "Clock period: 14.088ns (frequency: 70.984MHz) " > You said you constrained it to 100Mhz. > Probably the constraint was not properly applied and hence ignored by > the tool. Yes, my first experiments with the constraints didn't work, but now its already a little bit better (see my subposts to this topic) :) regards, BenjaminArticle: 83704
The LCD has to support a data stream with a divide-by-7 reference clock. Good info. Using the DDR registers you can have an effective divide-by-3.5 applied to your 360 MHz clock and DDR generated from the same 360 MHz clock. This looks from the outside as if it's a 720 MHz clock providing the divide-by-7 and the data running at 720 Mbits/s/pin just as if it were clocked with a 720 MHz clock. Your LCD doesn't have to understand DDR to receive 720 Mbit/s data streams and a 102.86 MHz clock. "Benjamin Menküc" <benjamin@menkuec.de> wrote in message news:d5dar6$nms$00$2@news.t-online.com... > Hi John, > > the clock is actually 360 MHz divided by 7. It's an asyncronous clock > like this "--___--". However the data goes at 360 MHz SDR. I have to use > SDR, because the LCD doesn't support DDR. > > regards, > BenjaminArticle: 83705
Hi John, > Using the DDR registers you can have an effective divide-by-3.5 applied to > your 360 MHz clock and DDR generated from the same 360 MHz clock. This > looks from the outside as if it's a 720 MHz clock providing the divide-by-7 > and the data running at 720 Mbits/s/pin just as if it were clocked with a > 720 MHz clock. > > Your LCD doesn't have to understand DDR to receive 720 Mbit/s data streams > and a 102.86 MHz clock. the max. pixelclock of the LCD is 80 MHz, that would be a LVDS clock of 560 MHz. Maybe when everything works (DVI-Link is the next challange now), I will try to tune up the LCD to 80 MHz using your DDR methodology. Thanks for the information. regards, BenjaminArticle: 83706
JD, As I have said before (and also explained it to you), the differences are swamped by the margin for process. As for a local version of the predictor, we no longer support the excel spreadsheet downloaded version. We are reconsidering that decision. Initially, there was only a spreadsheet for download. Then we had both the spreadsheet and the web based spreadsheet. How many folks out there want to have the local spreadsheet version for estimating? Austin JD_Design wrote: > Austin, > > I am probably not planning on using any of the DSP48 blocks, but I > noticed the same for them (no change over temperature). Apologies for > the skepticism, but it seems strange to me that I could load up my > device with DCMs, DSP48s, PPC405s and measure the power at room temp > and at high temp and have the difference between those two values be > the same difference I would get if I were using NONE of those resources > in the first place. > > Anyway, is there a spreadsheet for power calculations that I can get > that would allow me to both do this analysis offline? > > Thanks, > > JD > JDDC >Article: 83707
NET "YOU_CRAZY_MADMAN" MAXSKEW=100ps; "Wenjun Fu" <fwj@nmrs.ac.cn> wrote in message news:ee8dffe.9@webx.sUN8CHnE... > Thank you for your advice. I'll try to use DLL to double the FPGA Clock. > > But another question, can I use any timing constrains limits the delay difference of 2 inputs of a LUT to an accepted level? How?Article: 83708
As I understand it, the VIIPro devices have on-chip differential termination resistors which can be brought into play by selecting the XXX_LVDS_25_DT buffers. I've looked at several designs using VIIPro devices from different manufacturers but they all seem to use external 100R resistors to achieve LVDS termination. Can anyone tell me why this would be the case please? I thought the reduction in component count would be very welcome. Is it because of heat dissipation? TIA, Rog.Article: 83709
Roger, This is likely a case of old habits die hard. Also since this wasn't officially supported when Virtex-II Pro was first released the early the board was created the more likely the external resistor would be present. Since the "_DT" is true differential termination, there is no significant heat dissipation caused by using it. Unlike, the previous thevenin equivalent split termination version with a two 100 ohm loads between 2.5V and GND. Ed Roger wrote: > As I understand it, the VIIPro devices have on-chip differential termination > resistors which can be brought into play by selecting the XXX_LVDS_25_DT > buffers. I've looked at several designs using VIIPro devices from different > manufacturers but they all seem to use external 100R resistors to achieve > LVDS termination. Can anyone tell me why this would be the case please? I > thought the reduction in component count would be very welcome. Is it > because of heat dissipation? > > TIA, > > Rog. > >Article: 83710
Austin, Obviously, I vote for the spreadsheet :) Thanks! JDArticle: 83711
Marco wrote: > Hallo, > where I could find a complete manual (pdf) for programming in Ansi C? > > I need to understand the meaning of operators like: > |= > ^= > a & 0x07 > > Many Thanks > Marco > > Not sure, I'd recommend Google. As to your immediate question, &, |, and ^ are bitwise operators, not to be confused with &&, ||, ^^, which are logical operators. int A, B, C; C = A & B; /* bitwise and */ C = A | B; /* bitwise or */ C = A ^ B; /* bitwise xor */ The bitwise operators take two integers (run like hell if they're not integers), and perform an operation combining the high bit of A with the high bit of B, storing the result in the high bit of C, the next bit of A with the next bit of C into the next bit of C, and etc. The logical operators take two boolean values ( 0 is FALSE, anything else is TRUE ) and compare them in the same way. int A, B, C; C = A && B; /* set C true if A is true and B is true */ C = A || B; /* set C true if A is true or B is true */ C = A ^^ B; /* set C true if A is true xor B is true */ Your question as to |= and &= follow the C convention of allowing shorthand for assignment operators. A &= 5; /* A = A & 5 */ A |= 5; /* A = A | 5 */ A += 5; /* A = A + 5 */ Hope this helps. --RobArticle: 83712
So, it seems from another thread that the general consensus is somewhat against clock gating. I'm still somewhat new at the whole FPGA thing, so I was hoping for some input as to: a) Is this a general rule, or does it only apply to high speed clocks, and if so, what starts to become "high speed"? b) I'm using a Spartan III and currently using a BUFGCE to gate a 40 MHz clock that is only used externally. Is this poor form, or is it just clock gating through LUTs that's frowned upon? Any advice is, as always appreciated. -- RobArticle: 83713
I wonder if DVI can be implemented on an FPGA fabric - I mean receiver and transmitter. Some concerns I have: I/O cell Tx/Rx protocol Serialization Thanks in advance, LucArticle: 83714
Rob Gaddi wrote: > So, it seems from another thread that the general consensus is somewhat > against clock gating. let's count up the score: http://groups-beta.google.com/groups?q=gated+clock+enable+synchronous -- Mike TreselerArticle: 83715
Clock gating has two bad effects: The output of the gating is unavoidably delayed, so you end up with two flavors of the same basic clock, but with a slight timing difference. Can lead to bad hold-time isseus when your signal crosses between the domains. But the biggest problem occurs when the gating signal is asynchronous with the clock being gated. Then all hell breakes loose, since it will generate runt pulses and slivers in a totally uncontrolled way. There are clever ways around this (as I described in TechXclusives "Six Easy Pieces" and as implemented in the Virtex-4 clock multiplexer), but most savvy designers consider clock gating a "criminal offense". Peter AlfkeArticle: 83716
On Wed, 04 May 2005 14:32:19 -0700, EveEllsworth wrote: > I am a senior technical recruiter with a very reputable firm, Common > Agenda. I have postitions to post in the SF Bay Area and very real. > My client company is actively interviewing. > > Please advise if it is acceptable to post here. > > Eve Ellsworth > > Senior Recruiter > Common Agenda, LLP > Tel: (732) 223-7114 Ext. 108 > > Fax: (732) 223-7116 > Email: eve@commonagenda.com > > Web: www.commonagenda.com > ...Partnering with progressive companies in the quest for exceptional > talent... This is an international newsgroup - if you want to post something that is specific to some little country south of Canada, have the courtesy to the newsgroup and the pride in your country to make it clear which country you are referring to, both in the subject line and in the post, and remember that your post is irrelevant to a large proportion of readers (unless you are willing to pay *large* moving fees!).Article: 83717
Ed, Thanks again. So do the later Xilinx boards utilise the on-chip termination? Rog. "Ed McGettigan" <ed.mcgettigan@xilinx.com> wrote in message news:427A69B1.9060709@xilinx.com... > Roger, > > This is likely a case of old habits die hard. Also since this > wasn't officially supported when Virtex-II Pro was first released > the early the board was created the more likely the external > resistor would be present. > > Since the "_DT" is true differential termination, there is no > significant heat dissipation caused by using it. Unlike, the > previous thevenin equivalent split termination version with a > two 100 ohm loads between 2.5V and GND. > > Ed > > Roger wrote: >> As I understand it, the VIIPro devices have on-chip differential >> termination resistors which can be brought into play by selecting the >> XXX_LVDS_25_DT buffers. I've looked at several designs using VIIPro >> devices from different manufacturers but they all seem to use external >> 100R resistors to achieve LVDS termination. Can anyone tell me why this >> would be the case please? I thought the reduction in component count >> would be very welcome. Is it because of heat dissipation? >> >> TIA, >> >> Rog.Article: 83718
>I am designing a board with 9 Xilinx V4FX60 FPGA's configured via >System Ace CF controller. > >Does anyone have any experience regarding the max number of FPGA's in a >JTAG chain that can be succesfully configured? 9 is a big number. Be very careful of the clocks. I wouldn't expect problems with anything else. -- The suespammers.org mail server is located in California. So are all my other mailboxes. Please do not send unsolicited bulk e-mail or unsolicited commercial e-mail to my suespammers.org address or any of my other addresses. These are my opinions, not necessarily my employer's. I hate spam.Article: 83719
Jason, The Rosetta arrays use 100 devices in a single chain. We do buffer the clock to groups of ten FPGAs at a time. Austin jason.stubbs wrote: > I am designing a board with 9 Xilinx V4FX60 FPGA's configured via > System Ace CF controller. > > Does anyone have any experience regarding the max number of FPGA's in a > JTAG chain that can be succesfully configured? > > Was any signal buffering required to acieve this? > > Thanks > > Jason >Article: 83720
They should, but sometimes a circuit cut-and-paste from a previous schematic may have left in place or we may have left the external pads in place for flexibility. You can always desolder the external resistor and use the internal one instead. I'm fairly certain I had all of the external differential resistors removed for the Virtex-4 boards (ML40x, ML41x, ML42x) during the schematic reviews, but we may have simply missed one or two. Ed Roger wrote: > Ed, > > Thanks again. So do the later Xilinx boards utilise the on-chip termination? > > Rog. > > "Ed McGettigan" <ed.mcgettigan@xilinx.com> wrote in message > news:427A69B1.9060709@xilinx.com... > >>Roger, >> >>This is likely a case of old habits die hard. Also since this >>wasn't officially supported when Virtex-II Pro was first released >>the early the board was created the more likely the external >>resistor would be present. >> >>Since the "_DT" is true differential termination, there is no >>significant heat dissipation caused by using it. Unlike, the >>previous thevenin equivalent split termination version with a >>two 100 ohm loads between 2.5V and GND. >> >>Ed >> >>Roger wrote: >> >>>As I understand it, the VIIPro devices have on-chip differential >>>termination resistors which can be brought into play by selecting the >>>XXX_LVDS_25_DT buffers. I've looked at several designs using VIIPro >>>devices from different manufacturers but they all seem to use external >>>100R resistors to achieve LVDS termination. Can anyone tell me why this >>>would be the case please? I thought the reduction in component count >>>would be very welcome. Is it because of heat dissipation? >>> >>>TIA, >>> >>>Rog. > > >Article: 83721
Hi, > When you are cascading DCM's you should bring out the second DCM out of > reset after some delay from the time the first DCM is locked. There was > an appnote which used 16 bit shift register to delay the 'locked' signal > from the first DCM. That could be one of the problems. I have to do that now, because simulation doesn't work if I connect the inverted locked signal directly to the 2nd DCM. http://www.xilinx.com/xlnx/xil_ans_display.jsp?iCountryID=1&iLanguageID=1&getPagePath=19005&BV_SessionID=@@@@0453148829.1115333172@@@@&BV_EngineID=ccccaddeifmhfficflgcefldfhndfmo.0 Here Xilinx says the same, however it seems that this is only neccessary for simulation? Or is this any good for in hardware too? regards, BenjaminArticle: 83722
Thanks for the reply digi. The "BFM" acronym you gave reminded me that I had this package installed. When creating the custom peripheral, there was a options to generate simulation files (I think) and this prompted me to download edk_bfm_6_3.exe. I ran this and I suppose I am ready to run these BFM simulations. I found a .pdf on the Xilinx site about BFM simulations, but it isn't exhaustive (10 pgs). Assuming I have this piece of custom IP (built with the wizard to act as a slave on the PLB bus), do I start a new project in XPS to test it out? I see the bfm modules under the "add/edit cores" dialog but don't know how to go about using them. Do I do something like drop a PLB bus and hook my IP to it along with one of these bfm modules? If so, how do I get anything useful to play with in ModelSim? Any further advice is appreciated!Article: 83723
Thanks Mike. Now if there is a way to turn off the DCache register in C rather than in assembly..... "Mike Lewis" <someone@micrsoft.com> wrote in message news:p5qdneneUqv2TOXfRVn-gQ@magma.ca... > You have that area of the memory mapped cached ... you are seeing a cache > line > burst for the first access and nothing after that because it is manipulating > the cache memory ... turn off the cache for this memory region. > > Mike > > "bta3" <bta3@iname.com> wrote in message > news:4JTde.11307$o32.1391@fe09.lga... > > BlankHi, > > I seem to have a problem talking to a MAC chip that is connected as a > > memory mapped device on the EBI bus of an EPXA1-672 chip (EBI2 for CS, no > > split reads and no prefetch). EBI1 is connected to a flash chip. I am > > using > > the GNU toolset to develop code and no OS (as yet). > > > > Apparently, if I read a single register (in my code), a series of 16 read > > accesses are made by the chip and cached. Subsequent reads do not access > > the > > MAC, rather return values from the cache - I do not see any CS transitions > > at the chip pins. The write operations function perfectly well if I do not > > perform a read - one CS for every write request. Once a read is performed, > > the writes also cease to be "executed" and change the register value in > > the > > cache only. > > > > Has anyone seen a similar problem? The Altera folks have not responded to > > my trouble tickets - their support is not what it used to be. > > > > Thanks, bta3 > > > > > >Article: 83724
Hi, when I want to use a SRL16, I have to "include" the component in my entity like this: component SRL16 port ( Q : out std_logic; -- SRL data output A0: in std_logic; -- Select[0] input A1 : in std_logic; -- Select[1] input A2 : in std_logic; -- Select[2] input A3 : in std_logic; -- Select[3] input CLK : in std_logic; -- Clock input D : in std_logic -- SRL data input ); end component; Can I find templates for these component declarations somewhere? In the lib.pdf I can find only instantiation templates. Besides that, I can not use the generic map (INIT => X"0000")... How do I do it properly? Are there any include files for all the design elements? regards, Benjamin
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